UMC Develops BSI CIS Process on 12-inch Wafers

UMC CEO Shih-Wei Sun said at groundbreaking ceremony for its 300mm Fab 12A (Phase 5 & 6) at Tainan, south Taiwan fab complex: "UMC... cooperates closely with customers on 300mm specialty technologies such as... BSI CMOS image sensor... and 3D IC TSV to provide a truly comprehensive, leading foundry technology platform".