ST Combines TSV with EDoF

ST introduced the 1/4" optical format, 3MP raw Bayer sensors with integrated EDoF. The VD6853 and VD6803 sensors are said to enable camera modules as small as 6.5 x 6.5mm. EDoF extends the sensor's depth of field from 15cm to infinity. The sensors are available in ST’s TSV wafer-level package. This type of package enables the production of standard as well as wafer-level camera modules.

The 1.75um pixel-based VD6853 and VD6803 sensors differ in their interface: 10-bit parallel legacy interface in VD6803 and CCP2 interface in VD6853. Both provide 20fps speed at full resolution and use ST's 90nm CMOS process.

Engineering samples and demo-kits are available now, with the volume production scheduled for Q3 2009. Unit pricing is below $5, depending on the package types and shipment dates.