So, by the end of this year we are supposed to see wafer scale packaged sensors from most of the major sensors manufacturers. Somehow I don't see this happens.
Yole on 3D Packaging Roadmap
Yole Développement published a market report on adoption of wafer level packaging in image sensors and other areas. As far as I'm able to understand, on the graph below the yellow color means R&D activity, while the red is production.
So, by the end of this year we are supposed to see wafer scale packaged sensors from most of the major sensors manufacturers. Somehow I don't see this happens.
So, by the end of this year we are supposed to see wafer scale packaged sensors from most of the major sensors manufacturers. Somehow I don't see this happens.